FGF PLA Copper
FGF PLA COPPER is filled with 80% copper. With FGF PLA COPPER you can create the most beautiful objects with real METAL characteristics, such as a 3 x higher weight then PLA, a METAL feel & touch and thermal-conductivity. Due to the high percentage of fillers FGF PLA COPPER has virtually no shrinkage.
Features
- Approx. 80% copper content
- PLA-based, 3 times heavier
- Metal feel & “cold” touch
- Quick & easy polishing and other post-processing
| Description | Test method | Typical value |
|---|---|---|
| Specific gravity | ISO 1183 | 3,41 g/cc |
| MFR 210°C/2,16 kg | ISO 1133 | 85 g/10min |
| Tensile strength at yield | ISO 527 | 16 MPa |
| Tensile strength at break | ISO 527 | 14 Mpa |
| Elongation-strain at yield | ISO 527 | 1,6% |
| Elongation-strain at break | ISO 527 | 31,3% |
| Tensile modulus | ISO 527 | 3550 MPa |
| Impact strength - Charpy notched 23˚C | ISO 179 | 2,9 kJ/m2 |
| Vicat softening temperature | ISO 306 B50 | N/A |
| Mold shrinkage | internal method (ISO 294-4 based ) | 0,11% |
| Description | Typical value |
|---|---|
| Drying | 8hr,50°C*. <250ppm |
| Zone 1 Temperature | 160±20 °C |
| Zone 2 Temperature | 180±20 °C |
| Zone 3 Temperature | 175±20 °C |
| Mass temperature | 184°C |
| Die temperature | 160±20 °C |
Packaging
FGF PLA Copper is available in 20kg bag
Additional information
* Please consider the use of a hardened steel nozzle when printing with MT-COPPER .
The copper powder inside makes the filament abrasive and will result in fast wear of regular brass nozzles.
Storage
Cool and dry (15-25˚C) and away from UV light. This enhances the shelf life significantly.
