FGF PLA Copper

FGF PLA COPPER is filled with 80% copper. With FGF PLA COPPER you can create the most beautiful objects with real METAL characteristics, such as a 3 x higher weight then PLA, a METAL feel & touch and thermal-conductivity. Due to the high percentage of fillers FGF PLA COPPER has virtually no shrinkage.


  • Approx. 80% copper content
  • PLA-based, 3 times heavier
  • Metal feel & “cold” touch
  • Quick & easy polishing and other post-processing

Description Test method Typical value
Specific gravity ISO 1183 3,41 g/cc
MFR 210°C/2,16 kg ISO 1133 85 g/10min
Tensile strength at yield ISO 527 16 MPa
Tensile strength at break ISO 527 14 Mpa
Elongation-strain at yield ISO 527 1,6%
Elongation-strain at break ISO 527 31,3%
Tensile modulus ISO 527 3550 MPa
Impact strength - Charpy notched 23˚C ISO 179 2,9 kJ/m2
Vicat softening temperature ISO 306 B50 N/A
Mold shrinkage internal method (ISO 294-4 based ) 0,11%
Description Typical value
Drying 8hr,50°C*. <250ppm
Zone 1 Temperature 160±20 °C
Zone 2 Temperature 180±20 °C
Zone 3 Temperature 175±20 °C
Mass temperature 184°C
Die temperature 160±20 °C


FGF PLA Copper is available in 20kg bag

Additional information

* Please consider the use of a hardened steel nozzle when printing with MT-COPPER .
The copper powder inside makes the filament abrasive and will result in fast wear of regular brass nozzles.


Cool and dry (15-25˚C) and away from UV light. This enhances the shelf life significantly.
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